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Specifications
  • Adhesion in Microelectronics available on December 03 2023 from BiggerBooks for 80.34
  • Adhesion In Microelectronics available on October 03 2022 from Indigo for 215.0
  • ISBN bar code 9781118831335 ξ1 registered December 03 2023
  • ISBN bar code 9781118831335 ξ2 registered October 03 2022
  • Product category is Book

  • # 9781118831335R
  • # 978111883133

Among the topics to be covered include;Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion (metallized polymers)Polymer adhesion to various substratesAdhesion of thin filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of different dielectric materialsDelamination and reliability issues in packaged devicesInterface mechanics and crack propagationAdhesion measurement of thin films and coatings


References
    ^ (2015). Adhesion in Microelectronics BiggerBooks. (revised Dec 2023)
    ^ Adhesion In Microelectronics Indigo. (revised Oct 2022)

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