Microvias: For Low Cost, High Density Interconnects

 ( Book Product ) 

State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that’s changing the nature of printed circuit boards--and driving the mobile electronic revolution

• Microvias: For Low Cost, High Density Interconnects available on January 26 2016 from VitalSource for itemprop="offers" target="_external" title="" itemscope itemtype="http://schema.org/Offer">99.95
  
• ISBN bar code 9780071363273 ξ1 registered January 26 2016
  
• Product category is Book

• Sku # 9780071363273
  

A 'must' for electronics and mechanical engineers, John Lau and Ricky Lee’s intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.

^ Microvias: For Low Cost, High Density Interconnects VitalSource. ISBN 9780071363273 (revised Jan 2016)