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In electronics, through-hole technology (also spelled " thru-hole") is a manufacturing scheme in which leads on the components are inserted drilled in printed circuit boards (PCB) and soldering to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines.
Radial leads project more or less in parallel from the same surface or aspect of a component package, rather than from opposite ends of the package. Originally, radial leads were defined as more-or-less following a radius of a cylindrical component (such as a ceramic disk capacitor). Over time, this definition was generalized in contrast to axial leads, and took on its current form. When placed on a board, radial components "stand up" perpendicular, occupying a smaller footprint on sometimes-scarce "board real estate", making them useful in many high-density designs. The parallel leads projecting from a single mounting surface gives radial components an overall "plugin nature", facilitating their use in high-speed automated component insertion ("board-stuffing") machines.
When needed, an axial component can be effectively converted into a radial component, by bending one of its leads into a "U" shape so that it ends up close to and parallel with the other lead. Extra insulation with heat-shrink tubing may be used to prevent short circuit on nearby components. Conversely, a radial component can be pressed into service as an axial component by separating its leads as far as possible, and extending them into an overall length-spanning shape. These improvisations are often seen in breadboard or prototype construction, but are deprecated for mass production designs. This is because of difficulties in use with automated component placement machinery, and poorer reliability because of reduced vibration and mechanical shock resistance in the completed assembly.
Design engineers often prefer the larger through-hole rather than surface mount parts when prototyping, because they can be easily used with breadboard. However, high-speed or high-frequency designs may require SMT technology to minimize stray inductance and capacitance in wire leads, which would impair circuit function. Ultra-compact designs may also dictate SMT construction, even in the prototype phase of design.
Through-hole components are ideal for Prototype circuits with Breadboard using microprocessors such as Arduino or PICAXE. These components are large enough to be easy to use and solder by hand.
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